- Investment
- more than €250 million planned by 2033
- Capacity
- 50 million SiP components a year by 2033
Tessalia is an advanced semiconductor packaging joint venture of Foxconn, Radiall, and Thales, building an outsourced assembly and test site at Le Barp in Nouvelle-Aquitaine. Its foundation stone was laid on 1 June 2026, with production of system-in-package components due at the end of 2029 and more than €250 million of investment planned by 2033. It is one of two European advanced packaging efforts pointed at the same date, the other being a Dutch panel-level plan involving Nexperia's subsidiary Itec and TNO.