- Applied Materials partner since
- 2020
Besi is a Dutch maker of chip assembly equipment and a leader in hybrid bonding, the packaging step used to stack dies for AI chips. With Applied Materials it developed Kinex, an integrated die-to-wafer hybrid bonding system, after the two began working together in 2020. In October 2026 Besi joined Applied's Epic Center in Silicon Valley as an innovation partner, widening the work to die-on-die and die-on-panel integration and photonic interconnects.